SR EN 60068-2-54:2007

Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

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General information

Status : Withdrawn
Approval date : 3/16/2007
Publish date : 3/18/2007
Withdrawal date : 4/11/2020
Number of pages : 24
ICS : 19.040 Environmental testing,31.020 Electronic components in general
Technical Committee : 193 - Electronic assembly technology

Relations with other standards:

Replaces SR HD 323.2.54 S1:2002
Replaced by SR EN 60068-2-69:2017