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SR EN 61760-2:2007
Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and 'popcorning'. This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.
Status :
Withdrawn
Approval date : 12/17/2007
Publish date : 12/19/2007
Withdrawal date : 8/20/2024
Number of pages : 14
ICS : 31.020 Electronic components in general
Technical Committee : 193 - Electronic assembly technology
- Replaces SR EN 61760-2:2002
- Normative reference SR EN 61340-5-2:2002
- Normative reference SR EN 60721-3-2:2004
- Normative reference SR EN 60286-4:2001
- Normative reference SR EN 60286-5:2004
- Normative reference SR EN 60286-6:2004
- Normative reference SR EN 61340-5-1:2004
- Normative reference SR EN 60286-3:2008
- Replaced by SR EN IEC 61760-2:2021