SR EN 61190-1-3:2007/A1:2011

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

General information

Status : Withdrawn
Approval date : 4/29/2011
Withdrawal date : 1/17/2021
Number of pages : 23
ICS : 31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology

Relations with other standards:

Replaced by SR EN IEC 61190-1-3:2018
Amends SR EN 61190-1-3:2007