SR EN 60286-3:2014

Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

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General information

Status : Withdrawn
Approval date : 2/28/2014
Withdrawal date : 2/20/2022
Number of pages : 86
ICS : 31.020 Electronic components in general,31.240 Mechanical structures for electronic equipment
Technical Committee : 36 - Power electronic systems and equipment

Relations with other standards: