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SR EN 61191-2:2014
Printed board assemblies -- Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.
Status :
Withdrawn
Approval date : 3/31/2014
Withdrawal date : 10/13/2020
Number of pages : 63
ICS : 31.190 Electronic component assemblies,31.240 Mechanical structures for electronic equipment
Technical Committee : 193 - Electronic assembly technology
- Replaces SR EN 61191-2:2003
- Replaced by SR EN 61191-2:2018