RO
SR EN 61192-3:2003
Workmanship requirements for soldered electronic assemblies -- Part 3: Through-hole mount assemblies
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
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Status :
Withdrawn
Approval date : 10/31/2003
Publish date : 11/1/2003
Withdrawal date : 5/31/2019
Number of pages : 46
ICS : 31.190 Electronic component assemblies
Technical Committee : 18 - Piezoelectric devices for frequency control and selection