RO
SR EN 61249-8-8:2003
Materials for interconnection structures and assemblies. Part 8: Sectional specification set for non- conductive films and coatings.
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
Status :
Valid
Approval date : 11/30/2003
Publish date : 12/1/2003
Number of pages : 28
ICS : 31.180 Printed circuits and boards
Technical Committee : 193 - Electronic assembly technology