SR EN 61189-2:2003

Test methods for electrical materials printed board and other interconnection structures and assemblies. Part 2: Test methods for materials for interconnection structures.

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

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General information

Status : Withdrawn
Approval date : 11/30/2003
Publish date : 12/1/2003
Withdrawal date : 9/1/2009
Number of pages : 149
ICS : 31.180 Printed circuits and boards
Technical Committee : 193 - Electronic assembly technology

Relations with other standards:

Replaced by SR EN 61189-2:2007
Amended by SR EN 61189-2:2003/A1:2003