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SR EN 61190-1-3:2003
Attachment materials for electronic assembly. Part 1- 3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solders for electronic soldering applications.
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Status :
Withdrawn
Approval date : 11/30/2003
Publish date : 12/1/2003
Withdrawal date : 5/1/2010
Number of pages : 74
ICS : 31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology
- Replaced by SR EN 61190-1-3:2007