RO
SR EN 61249-5-1:2003
Materials for interconnection structures and assemblies. Part 5: Sectional specifications set for conductive foils and films or without coatings. Section 1: Copper foils for the manufacture of copper- clad base materials.
Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
Status :
Valid
Approval date : 11/30/2003
Publish date : 12/1/2003
Number of pages : 47
ICS : 31.180 Printed circuits and boards
Technical Committee : 193 - Electronic assembly technology