RO
SR EN 60749-20:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
Status :
Withdrawn
Approval date : 9/30/2004
Publish date : 10/1/2004
Withdrawal date : 9/1/2012
Number of pages : 58
ICS : 31.080.01 Semiconductor devices in general
Technical Committee : 17 - Discrete semiconductor devices
- Replaced by SR EN 60749-20:2010