SR EN ISO 9453:2007

Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver; tin-indium, with and without silver and bismuth; tin-silver, with and without copper and bismuth; tin-zinc, with and without bismuth. ISO 9453:2006 also includes an indication of the forms generally available.

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General information

Status : Withdrawn
Approval date : 3/22/2007
Publish date : 3/24/2007
Withdrawal date : 1/30/2015
Number of pages : 19
ICS : 25.160.50 Brazing and soldering
Technical Committee : 39 - Welding and allied processes

Relations with other standards:

Replaces SR EN 29453:1995
Replaced by SR EN ISO 9453:2015