SR EN 29453:1995
Soft soldering fluxes - Chemical compositions and forms (ISO 9453:1990)
This standard specifies requirements for chemical composition for the following families of soft solder alloys, tin-lead, with and without antimony; tin silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; and lead-silver, with and without tin.
You must log in to add this product to favorites.
Status :
Withdrawn
Approval date : 7/30/1994
Publish date : 1/1/1995
Romanian version publish date : 7/30/1994
Withdrawal date : 3/22/2007
Number of pages : 8
ICS : 25.160.50 Brazing and soldering
Technical Committee : 39 - Welding and allied processes
- Replaces STAS 96-87
- Replaces (partial) SR ISO 10564:1995
- Replaced by SR EN ISO 9453:2007
RO