RO
SR EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.
Status :
Valid
Approval date : 7/31/2008
Publish date : 8/2/2008
Number of pages : 125
ICS : 31.180 Printed circuits and boards
Technical Committee : 193 - Electronic assembly technology
- Replaces SR EN 61189-3:2003
- Replaces SR EN 61189-3:2003/A1:2003