RO
SR EN 61189-3:2003
Test methods for electrical materials, interconnection structures and assemblies. Part 3: Test methods for interconnection structures (printed boards).
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.
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Status :
Withdrawn
Approval date : 11/30/2003
Publish date : 12/1/2003
Withdrawal date : 12/1/2010
Number of pages : 54
ICS : 31.180 Printed circuits and boards
Technical Committee : 193 - Electronic assembly technology
- Replaced by SR EN 61189-3:2008
- Amended by SR EN 61189-3:2003/A1:2003