SR EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Add to cart

General information

Status : Valid
Approval date : 6/30/2021
Number of pages : 72
ICS : 31.180 Printed circuits and boards,31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology

Relations with other standards:

Replaces SR EN 61188-5-1:2003