SR EN 61188-5-1:2003

Printed boards and printed board assemblies. Design and use. Part 5- 1: Attachment (land/ joint) considerations. Generic requirements.

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

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General information

Status : Withdrawn
Approval date : 11/28/2003
Publish date : 11/29/2003
Withdrawal date : 3/30/2024
Number of pages : 150
ICS : 31.180 Printed circuits and boards,31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology

Relations with other standards:

Replaced by SR EN IEC 61188-6-1:2021