SR EN 60068-2-58:2003

Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

General information

Status : Withdrawn
Approval date : 10/31/2003
Publish date : 11/1/2003
Withdrawal date : 9/1/2007
Number of pages : 20
ICS : 19.040 Environmental testing,31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology

Relations with other standards:

Replaced by SR EN 60068-2-58:2005