RO
SR EN 60068-2-58:2005
Environmental testing. Part 2-58: Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.
Status :
Withdrawn
Approval date : 6/30/2005
Publish date : 7/1/2005
Withdrawal date : 5/1/2018
Number of pages : 30
ICS : 19.040 Environmental testing,31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology
- Replaces SR EN 60068-2-58:2003
- Normative reference SR EN 60068-1:1995
- Normative reference SR EN 61190-1-1:2003
- Normative reference SR EN 60749-20:2004
- Normative reference SR EN 61760-1:2007
- Normative reference SR EN 60194:2007
- Normative reference SR EN 61190-1-3:2007
- Normative reference SR EN 61191-2:2003
- Normative reference SR HD 323.2.20 S3:2004
- Replaced by SR EN 60068-2-58:2015