RO
SR EN 60068-2-69:2003
Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
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Status :
Withdrawn
Approval date : 10/31/2003
Publish date : 11/1/2003
Withdrawal date : 6/1/2010
Number of pages : 24
ICS : 19.040 Environmental testing
Technical Committee : 193 - Electronic assembly technology
- Replaced by SR EN 60068-2-69:2008