RO
SR EN 60068-2-69:2008
Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows: - Inclusion of lead-free alloy test conditions; - Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; - Inclusion of new component types, and updating test par
Status :
Withdrawn
Approval date : 1/28/2008
Publish date : 1/30/2008
Withdrawal date : 4/11/2020
Number of pages : 28
ICS : 19.040 Environmental testing,31.190 Electronic component assemblies
Technical Committee : 193 - Electronic assembly technology
- Replaces SR EN 60068-2-69:2003
- Normative reference SR EN 60068-2-54:2007
- Normative reference SR EN ISO 683-17:2002
- Normative reference SR HD 323.2.20 S3:2004
- Normative reference SR EN 60068-1:1995
- Normative reference SR EN 61190-1-3:2003
- Replaced by SR EN 60068-2-69:2017